New useful information from simple forward I-V measurement of a power diode CONFERENCE PAPERS New useful information from simple forward I-V measurement of a power diode Read More »
Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer CONFERENCE PAPERS Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer Read More »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications CONFERENCE PAPERS Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Read More »
Industry-university R&D collaboration: expectation and reality CONFERENCE PAPERS Industry-university R&D collaboration: expectation and reality Read More »
Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing CONFERENCE PAPERS Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing Read More »
Reliabiilty Analysis and Application with MATLAB (invited) CONFERENCE PAPERS Reliabiilty Analysis and Application with MATLAB (invited) Read More »
Low temperature wafer bonding in medium vacuum CONFERENCE PAPERS Low temperature wafer bonding in medium vacuum Read More »
Building empirical model through simulation a case study CONFERENCE PAPERS Building empirical model through simulation a case study Read More »
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer CONFERENCE PAPERS Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer Read More »
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) CONFERENCE PAPERS Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) Read More »