C. M. Tan and K. N. C. Yeo. “Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT),” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 167-172.
C. M. Tan and K. N. C. Yeo. “Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT),” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 167-172.