Interface fracture toughness assessment of solder joints using double cantilever beam test JOURNAL PAPERS Interface fracture toughness assessment of solder joints using double cantilever beam test Read More »
Indentation size effect on the creep behavior of a SnAgCu solder JOURNAL PAPERS Indentation size effect on the creep behavior of a SnAgCu solder Read More »
Electromigration in width transition copper interconnect JOURNAL PAPERS Electromigration in width transition copper interconnect Read More »
Indentation size effect on the creep behavior of a Sn-Ag-Cu solder CONFERENCE PAPERS Indentation size effect on the creep behavior of a Sn-Ag-Cu solder Read More »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes CONFERENCE PAPERS Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes Read More »
Indentation size effect on the hardness of a Sn-Ag-Cu Solder CONFERENCE PAPERS Indentation size effect on the hardness of a Sn-Ag-Cu Solder Read More »
Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes CONFERENCE PAPERS Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes Read More »
Requirement for accurate interconnect temperature measurement for Electromigration test CONFERENCE PAPERS Requirement for accurate interconnect temperature measurement for Electromigration test Read More »
Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials JOURNAL PAPERS Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials Read More »
Review of electromigration modeling of IC Interconnects JOURNAL PAPERS Review of electromigration modeling of IC Interconnects Read More »