J. Zhang, K. Ghosh, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan, “TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current,” in Int. Conf. on Solid State Devices and Materials, Kyoto, Japan, 25-27th Sep. 2012.