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Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief JOURNAL PAPERS Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief Read More »
3D simulation-based research on the effect of interconnect structures on circuit reliability JOURNAL PAPERS 3D simulation-based research on the effect of interconnect structures on circuit reliability Read More »
Degradation behavior of high power light emitting diode under high frequency switching JOURNAL PAPERS Degradation behavior of high power light emitting diode under high frequency switching Read More »
Comparison of electromigration simulation in test structure and actual circuit JOURNAL PAPERS Comparison of electromigration simulation in test structure and actual circuit Read More »
Reliability study of LED driver – a case study of black box testing JOURNAL PAPERS Reliability study of LED driver – a case study of black box testing Read More »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints JOURNAL PAPERS Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints Read More »
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test JOURNAL PAPERS Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test Read More »
Effect of IC layout on the reliability of CMOS amplifiers JOURNAL PAPERS Effect of IC layout on the reliability of CMOS amplifiers Read More »
Applications of Finite element Methods for Reliability Study of ULSI Interconnections JOURNAL PAPERS Applications of Finite element Methods for Reliability Study of ULSI Interconnections Read More »