Analysis of electromigration test data CONFERENCE PAPERS Analysis of electromigration test data Read More »
Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures CONFERENCE PAPERS Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures Read More »
Metastability in tritiated amorphous silicon CONFERENCE PAPERS Metastability in tritiated amorphous silicon Read More »
Backside copper contamination issues in CMOS integrated circuits CONFERENCE PAPERS Backside copper contamination issues in CMOS integrated circuits Read More »
Reliability data analysis software development CONFERENCE PAPERS Reliability data analysis software development Read More »
A new quality control parameter in wafer fabrication for wire bonding integrity CONFERENCE PAPERS A new quality control parameter in wafer fabrication for wire bonding integrity Read More »
Integrating device modeling in QFD implementation for power electronics applications CONFERENCE PAPERS Integrating device modeling in QFD implementation for power electronics applications Read More »
Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) CONFERENCE PAPERS Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) Read More »
Selection of failure time within test time interval for group reliability data analysis CONFERENCE PAPERS Selection of failure time within test time interval for group reliability data analysis Read More »
Thermal stress distribution in the SOI structure CONFERENCE PAPERS Thermal stress distribution in the SOI structure Read More »
