Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects CONFERENCE PAPERS Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects Read More »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test CONFERENCE PAPERS Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test Read More »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) CONFERENCE PAPERS Investigation of the physical processes during electromigration of ULSI interconnection (invited) Read More »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects CONFERENCE PAPERS Effects of Cu surface cleanness on electromigration reliability of Cu interconnects Read More »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances CONFERENCE PAPERS Overcoming intrinsic weakness of ULSI metallization on electromigration performances Read More »
Low temperature silicon wafer bonding by sol-gel processing JOURNAL PAPERS Low temperature silicon wafer bonding by sol-gel processing Read More »
Methodology for customer’s focus build-in reliability JOURNAL PAPERS Methodology for customer’s focus build-in reliability Read More »
A novel technique to re-construct three dimensional void in passivated metal interconnects CONFERENCE PAPERS A novel technique to re-construct three dimensional void in passivated metal interconnects Read More »
Silicon-to-silicon wafer bonding efficiency by sol-gel process CONFERENCE PAPERS Silicon-to-silicon wafer bonding efficiency by sol-gel process Read More »
Study of interaction between a-Ta films and SiO2 under rapid thermal annealing CONFERENCE PAPERS Study of interaction between a-Ta films and SiO2 under rapid thermal annealing Read More »