Cubic Ta diffusion barrier layers for Cu metallization CONFERENCE PAPERS Cubic Ta diffusion barrier layers for Cu metallization Read More »
Characterization of a-Ta diffusion barrier for copper metallization CONFERENCE PAPERS Characterization of a-Ta diffusion barrier for copper metallization Read More »
Improvement of Ta diffusion barrier by NH3 plasma pre-treatment CONFERENCE PAPERS Improvement of Ta diffusion barrier by NH3 plasma pre-treatment Read More »
Novel rapid nondestructive technique for locating tiny voids in metallization line CONFERENCE PAPERS Novel rapid nondestructive technique for locating tiny voids in metallization line Read More »
Diffusion studies of Cu in Si and low-k dielectric materials CONFERENCE PAPERS Diffusion studies of Cu in Si and low-k dielectric materials Read More »
QFD implementation in a discrete semiconductor industry CONFERENCE PAPERS QFD implementation in a discrete semiconductor industry Read More »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis CONFERENCE PAPERS Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis Read More »
Analysis of electromigration test data CONFERENCE PAPERS Analysis of electromigration test data Read More »
Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures CONFERENCE PAPERS Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures Read More »