Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay CONFERENCE PAPERS Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay Read More »
Reliability study of LED driver – a case study of black box testing CONFERENCE PAPERS Reliability study of LED driver – a case study of black box testing Read More »
Degradation behaviour of high power light emitting diode under high frequency switching CONFERENCE PAPERS Degradation behaviour of high power light emitting diode under high frequency switching Read More »
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current CONFERENCE PAPERS TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current Read More »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints JOURNAL PAPERS Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints Read More »
Recent Development of Reliability and Maintenance (Invited Talk) CONFERENCE PAPERS Recent Development of Reliability and Maintenance (Invited Talk) Read More »
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test JOURNAL PAPERS Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test Read More »
Effect of IC layout on the reliability of CMOS amplifiers JOURNAL PAPERS Effect of IC layout on the reliability of CMOS amplifiers Read More »
Applications of Finite element Methods for Reliability Study of ULSI Interconnections JOURNAL PAPERS Applications of Finite element Methods for Reliability Study of ULSI Interconnections Read More »
ICMAT 2011 – Reliability and variability of semiconductor devices and ICs JOURNAL PAPERS ICMAT 2011 – Reliability and variability of semiconductor devices and ICs Read More »