Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding JOURNAL PAPERS Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding Read More »
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification JOURNAL PAPERS Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Read More »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect JOURNAL PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects JOURNAL PAPERS Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Read More »
Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling CONFERENCE PAPERS Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling Read More »
Development of highly accelerated electromigration test CONFERENCE PAPERS Development of highly accelerated electromigration test Read More »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect CONFERENCE PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Electromigration in damascene copper interconnects of line width down to 100 nm JOURNAL PAPERS Electromigration in damascene copper interconnects of line width down to 100 nm Read More »
Development of highly accelerated electromigration test JOURNAL PAPERS Development of highly accelerated electromigration test Read More »
Device level electrical-thermal-stress coupled-field modeling JOURNAL PAPERS Device level electrical-thermal-stress coupled-field modeling Read More »