Application of FMEA for build-in reliability and maintenance (invited) CONFERENCE PAPERS Application of FMEA for build-in reliability and maintenance (invited) Read More »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing CONFERENCE PAPERS Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing Read More »
Non-destructive void size determination in copper metallization under passivation JOURNAL PAPERS Non-destructive void size determination in copper metallization under passivation Read More »
Temperature and stress distribution in the SOI structure during fabrication JOURNAL PAPERS Temperature and stress distribution in the SOI structure during fabrication Read More »
A new method for deposition of cubic Ta diffusion barrier for Cu metallization JOURNAL PAPERS A new method for deposition of cubic Ta diffusion barrier for Cu metallization Read More »
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding JOURNAL PAPERS Failure mechanisms of aluminum bond pad peeling during thermosonic bonding Read More »
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects CONFERENCE PAPERS Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects Read More »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test CONFERENCE PAPERS Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test Read More »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) CONFERENCE PAPERS Investigation of the physical processes during electromigration of ULSI interconnection (invited) Read More »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects CONFERENCE PAPERS Effects of Cu surface cleanness on electromigration reliability of Cu interconnects Read More »