A new quality control parameter in wafer fabrication for wire bonding integrity CONFERENCE PAPERS A new quality control parameter in wafer fabrication for wire bonding integrity Read More »
Integrating device modeling in QFD implementation for power electronics applications CONFERENCE PAPERS Integrating device modeling in QFD implementation for power electronics applications Read More »
Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) CONFERENCE PAPERS Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) Read More »
Selection of failure time within test time interval for group reliability data analysis CONFERENCE PAPERS Selection of failure time within test time interval for group reliability data analysis Read More »
Using power diode models for circuit simulations – a comprehensive review JOURNAL PAPERS Using power diode models for circuit simulations – a comprehensive review Read More »
Effect of BOE etching time on wire bonding qualit JOURNAL PAPERS Effect of BOE etching time on wire bonding qualit Read More »
Thermal stress distribution in the SOI structure CONFERENCE PAPERS Thermal stress distribution in the SOI structure Read More »
Failure analysis of bond pad metal peeling using FIB and AFM JOURNAL PAPERS Failure analysis of bond pad metal peeling using FIB and AFM Read More »
Computerization of quality control in electronics components industry CONFERENCE PAPERS Computerization of quality control in electronics components industry Read More »
Electronic properties of n-i-n-i doping superlattices JOURNAL PAPERS Electronic properties of n-i-n-i doping superlattices Read More »