Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board CONFERENCE PAPERS Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board Read More »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist CONFERENCE PAPERS Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Read More »
Non-destructive void size determination in copper metallization under passivation JOURNAL PAPERS Non-destructive void size determination in copper metallization under passivation Read More »
A novel technique to re-construct three dimensional void in passivated metal interconnects CONFERENCE PAPERS A novel technique to re-construct three dimensional void in passivated metal interconnects Read More »
Novel rapid nondestructive technique for locating tiny voids in metallization line CONFERENCE PAPERS Novel rapid nondestructive technique for locating tiny voids in metallization line Read More »
Failure analysis of bond pad metal peeling using FIB and AFM JOURNAL PAPERS Failure analysis of bond pad metal peeling using FIB and AFM Read More »