A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints JOURNAL PAPERS A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints Read More »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes JOURNAL PAPERS Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes Read More »
A holistic numerical modeling for interconnect electromigration CONFERENCE PAPERS A holistic numerical modeling for interconnect electromigration Read More »
Size effect in Cu nano-interconnects and its implication on electromigration CONFERENCE PAPERS Size effect in Cu nano-interconnects and its implication on electromigration Read More »
Very high current density package level electromigration test for copper interconnects JOURNAL PAPERS Very high current density package level electromigration test for copper interconnects Read More »
A bimodal 3-parameter lognormal mixture distribution for electromigration failures JOURNAL PAPERS A bimodal 3-parameter lognormal mixture distribution for electromigration failures Read More »
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system CONFERENCE PAPERS Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system Read More »
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature CONFERENCE PAPERS The multiple temperature heater platforms for solder Electromigration test conducted at room temperature Read More »
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress CONFERENCE PAPERS A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress Read More »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens CONFERENCE PAPERS Fracture Toughness Assessment of a solder joint using double cantilever beam specimens Read More »