Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect CONFERENCE PAPERS Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Read More »
Electromigration in damascene copper interconnects of line width down to 100 nm JOURNAL PAPERS Electromigration in damascene copper interconnects of line width down to 100 nm Read More »
Development of highly accelerated electromigration test JOURNAL PAPERS Development of highly accelerated electromigration test Read More »
Device level electrical-thermal-stress coupled-field modeling JOURNAL PAPERS Device level electrical-thermal-stress coupled-field modeling Read More »
Mapping of solder mask covered interconnects on high density printed circuit board CONFERENCE PAPERS Mapping of solder mask covered interconnects on high density printed circuit board Read More »
Device level electrical-thermal-stress coupled-field modeling CONFERENCE PAPERS Device level electrical-thermal-stress coupled-field modeling Read More »
A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs CONFERENCE PAPERS A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs Read More »
A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry CONFERENCE PAPERS A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry Read More »
A cost model for the predictive maintenance policy of a multi-state system CONFERENCE PAPERS A cost model for the predictive maintenance policy of a multi-state system Read More »
Predictive maintenance and its impact to business decision (invited) CONFERENCE PAPERS Predictive maintenance and its impact to business decision (invited) Read More »