Building empirical model through simulation a case study CONFERENCE PAPERS Building empirical model through simulation a case study Read More »
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer CONFERENCE PAPERS Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer Read More »
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) CONFERENCE PAPERS Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) Read More »
Application of FMEA for build-in reliability and maintenance (invited) CONFERENCE PAPERS Application of FMEA for build-in reliability and maintenance (invited) Read More »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing CONFERENCE PAPERS Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing Read More »
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects CONFERENCE PAPERS Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects Read More »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test CONFERENCE PAPERS Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test Read More »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) CONFERENCE PAPERS Investigation of the physical processes during electromigration of ULSI interconnection (invited) Read More »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects CONFERENCE PAPERS Effects of Cu surface cleanness on electromigration reliability of Cu interconnects Read More »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances CONFERENCE PAPERS Overcoming intrinsic weakness of ULSI metallization on electromigration performances Read More »