Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects CONFERENCE PAPERS Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects Read More »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test CONFERENCE PAPERS Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test Read More »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) CONFERENCE PAPERS Investigation of the physical processes during electromigration of ULSI interconnection (invited) Read More »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects CONFERENCE PAPERS Effects of Cu surface cleanness on electromigration reliability of Cu interconnects Read More »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances CONFERENCE PAPERS Overcoming intrinsic weakness of ULSI metallization on electromigration performances Read More »
Cubic Ta diffusion barrier layers for Cu metallization CONFERENCE PAPERS Cubic Ta diffusion barrier layers for Cu metallization Read More »
Characterization of a-Ta diffusion barrier for copper metallization CONFERENCE PAPERS Characterization of a-Ta diffusion barrier for copper metallization Read More »
Improvement of Ta diffusion barrier by NH3 plasma pre-treatment CONFERENCE PAPERS Improvement of Ta diffusion barrier by NH3 plasma pre-treatment Read More »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis CONFERENCE PAPERS Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis Read More »
Analysis of electromigration test data CONFERENCE PAPERS Analysis of electromigration test data Read More »